Dec 07, 2025  
Rensselaer Catalog 2025-2026 
    
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Rensselaer Catalog 2025-2026

ECSE 6306 - Integrated Circuit Packaging

In this survey level course students explore packaging as the final element in the IC production processes. Students evaluate packaging types, design, processes, reliability and challenges. Students research different advanced packaging options and future trends for a variety of applications.

Prerequisite or Corequisite: None.

When Offered: AVAILABILITY OF INSTRUCTOR

Graded: GRADED

Credit Hours: 1